| 摘要 |
PURPOSE:To improve heat resistance by dispersing a specific photosensitive agent and sensitizer into specific polyamic acid thereby generating the crosslinking with a small quantity of irradiation to provide a high sensitivity and further fully thermally splashing the photoset acrylates of the polyimide after thermal curing. CONSTITUTION:The compsn. contains the polyamic acid formed by copolymerizing 5 to 50wt.% silicone diamine expressed by formula I (where n is 3 to 50) and the amine compd. expressed by formula II (where Rf is -H, CH3, C2H5; R2 is H, CH3; X is O or NH; n is 2 to 3) as the photosensitive agent. Further, the compsn. contains the biscumarine compd. which is expressed by formula III (where R1, R2 are H, alkoxy group, dialkyl amino group) and is subjected to carbonyl substitution at the 3-position as the sensitizer. The compsn. is formed by using 20 to 200pts.wt. photosensitive agent and 1 to 20pts. wt. sensitizer per 100pts.wt. polyamic acid as the essential components. The photosetting property of the high sensitivity is obtd. in this way and further, the film after thermosetting is highly resistant to heat, heat cycle, heat shock and moisture. |
