发明名称 HOT-MELT ADHESIVE COMPOSITION
摘要 <p>The present invention is directed to a hot-melt adhesive containing at least one propylene/1-hexene copolymer. The adhesive contains an amount of a low viscosity, substantially crystalline wax, having a melting point of about 90°C to about 125°C, sufficient to improve the elastic delamination resistance of the adhesive. The adhesives are particularly useful in disposable diaper construction.</p>
申请公布号 WO1990010040(A1) 申请公布日期 1990.09.07
申请号 US1990001093 申请日期 1990.02.22
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