发明名称 ENCAPSULATING MATERIAL RESIN FOR SEMICONDUCTOR AND SEMICONDUCTOR ELEMENT
摘要 PROBLEM TO BE SOLVED: To obtain a semiconductor device with high adhesion property or weather resistance while reducing the amount of usage of admixture, so that the admixture that is soluble to an encapsulating material resin has a concentration gradient in the sectional thickness direction of the encapsulating material resin. SOLUTION: In a solar cell module 100, light from the outside enters from a surface member 103 and reaches a photovoltaic element 101. For improving the adhesion property with an encapsulating material resin 102 using a surface resin film as the surface member 103, surface treatment such as corona discharge treatment is made to the entire surface resin film 103, thus obtaining the concentration gradient of an admixture in the encapsulating material resin 102. For covering the photovoltaic element light reception surface with the encapsulating material resin 102 and the surface member 103, an electric field is applied to the encapsulating resin 102 in a process for creating the sheet-shaped encapsulating material resin 102 or the like, the admixture with a polarity in the encapsulating material resin 102 is subjected to cataphoresis, thus giving concentration gradient in the thickness direction of the encapsulating material resin 102.
申请公布号 JPH11317475(A) 申请公布日期 1999.11.16
申请号 JP19990042912 申请日期 1999.02.22
申请人 CANON INC 发明人 KISO MORIO;YAMADA SATOSHI;SHIOZUKA HIDENORI;KATAOKA ICHIRO;YOSHIMITSU HIDESATO
分类号 H01L31/04;C08K3/00;C08K5/00;C08L101/00;H01L23/29;H01L23/31;H01L31/02 主分类号 H01L31/04
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