| 摘要 |
<p>PURPOSE: To increase the current capacity of the conductive path of a printed-wiring board and also to increase the current capacity of a five wiring circuit board by a method wherein the deposited part of a general solder containing tin as its main component, which can be obtained by the special positional relation of the printed- wiring board with jumpers, it utilized. CONSTITUTION: Jumpers 11 each pass through a hole 5, jumper parts 13, which are out of the conductor side holes formed in a substrate, are parallel to each other and the jumpers are bent at 90 deg. at places which are out of the holes in the circuit side of the substrate, and are installed in contact with a foil 3 or is very close to the foil 3. Moreover, parts 15, which are out from the component sides of the holes 5, of the jumpers 11 are formed vertically to the surfaces of components or at a small angle to the surfaces of the components and the jumpers 11 and the jumper parts 13 are held at prescribed positions prior to soldering. A solder is fed to the jumper parts 13 of the jumpers 11 by a standard soldering method or the like, whereby the amount of the solder 17 between the jumper parts 13 is integrated on both directions of the directions of the jumpers along the substrate 1 and the direction vertical to the substrate 1. Thereby, the current capacity of the conductive path of a printed- wiring board can be increased.</p> |
