| 摘要 |
<p>PURPOSE:To simplify a process by bonding a conductive metal foil to a flexible unhardened resin plate, and molding into a desired shape by bending and squeezing the unhardened resin plate after a circuit pattern is formed. CONSTITUTION:A conductive metal foil 11 is pasted onto a flexible unhardened resin plate 10, and a desired circuit pattern 12 is formed by etching. Next, the unhardened resin plate 10 is bent and squeezed by a pair of press molds and molded into a desired shape such as a box-shaped case 13. The resin 10 is hardened at the same time as for the processing, thus a three-dimensional molded circuit is formed. As a result, even a complex pattern can be formed easily, and the process is shortened and simplified.</p> |
