MANUFACTURE OF BUMP MATERIAL FOR SEMICONDUCTOR ELEMENT,申请号JP19890044257-传众专利搜索

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发明名称	MANUFACTURE OF BUMP MATERIAL FOR SEMICONDUCTOR ELEMENT
摘要
申请公布号	JPH02224247(A)	申请公布日期	1990.09.06
申请号	JP19890044257	申请日期	1989.02.25
申请人	NIPPON STEEL CORP;OKI ELECTRIC IND CO LTD	发明人	ONO TAKAHIDE;OTSUKA HIROAKI;OZEKI YOSHIO;WATANABE KEISUKE;KANAMORI TAKASHI;IGUCHI YASUO
分类号	H01L21/60;H01L21/321	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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