发明名称 POLYAMIDE COMPOSITION FOR MOLDING
摘要 A polyamide composition for molded products having thin-wall parts and for connectors for use in automobiles, containing: A) 100 wt parts of a semi- aromatic polyamide having a melting point of 280 to 320 ~C and a glass transition temperature of 95 to 115 ~C, wherein the amount of aromatic monom er constituting the polyamide is at least 30 mol %, and B) 1 to 70 wt parts of an impact resistance agent composed mainly of a modified polyolefin that has be en graft-modified by means of a carboxylic acid or a carboxylic anhydride.</SDO AB>
申请公布号 CA2341992(A1) 申请公布日期 2000.05.04
申请号 CA19992341992 申请日期 1999.10.22
申请人 E.I. DU PONT DE NEMOURS AND COMPANY 发明人 KOSHIDA, REIKO;UNE, NARUMI;HAYASHI, RYUICHI;ISHIZUKA, SHIGEO;TANAKA, TAMOO
分类号 H01R13/46;C08L77/00;C08L77/06;(IPC1-7):C08L77/06;H01B3/30 主分类号 H01R13/46
代理机构 代理人
主权项
地址
您可能感兴趣的专利