发明名称 |
Flip chip solder bond structure for devices with gold based metallisation |
摘要 |
An arrangement for solder bonding a flip chip to a semiconductor substrate having thereon layers of metallisation which have a tendency to interact with a solder material, comprises forming on said layers of metallisation a barrier metallisation layer which is not reactive with said solder material, forming solder pads on the barrier layer and thereafter forming solder bonds with such solder pads employing said solder material. |
申请公布号 |
GB2228825(A) |
申请公布日期 |
1990.09.05 |
申请号 |
GB19890011147 |
申请日期 |
1989.05.16 |
申请人 |
THE * PLESSEY COMPANY PLC |
发明人 |
DAVID JOHN * WARNER;KIM LOUISE * PICKERING;DAVID JOHN * PEDDER |
分类号 |
G02B6/42;H01L21/60;H01L23/485;H01L23/532 |
主分类号 |
G02B6/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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