| 摘要 |
In a hybrid integrated circuit structure comprising a ceramic substrate having a hybrid integrated circuit including a circuit section which is liable to develop a lot of heat to become a higher temperature, the thickness of that portion of the ceramic substrate which has the circuit section liable to develop a lot of heat to become a higher temperature is significantly reduced. A heat dissipater or a cooling device is mounted on a back of the ceramic substrate at its thinner portion. The hybrid integrated circuit structure is produced by preparing a plurality of thinner ceramic substrate pieces; removing, with at least one of the ceramic substrate pieces being excluded, a portion of each of other ceramic substrate peices corresponding to a location having a circuit section which is liable to develop a lot of heat to become a higher temperature, thereby providing a cut-away portion, the printing of the circuit onto the ceramic substrate pieces being conducted before or after formation of the cut-away portion; bonding the at least one ceramic substrate piece having no cut-away portion to the ceramic substrate pieces having the cut-away portion by a bonding material to provide a hybrid integrated circuit board; and mounting a circuit component which is liable to develop a lot of heat to become a higher temperature onto the thinner portion of the hybrid integrated circuit substrate, and mounting a circuit component which develops no heat onto the thicker portion of the hybrid integrated circuit substrate, thereby forming a hybrid integrated circuit. |
