| 摘要 |
PURPOSE:To enable a simple and excellent stacking process to be executed by a method wherein the aluminum faces of a first and a second aluminum copper foil formed of copper and aluminum are joined together in a separable manner into an integral structure. CONSTITUTION:An outer material is composed of a first aluminum copper foil formed of a copper foil 43 provided to the side of the an aluminum foil 41 through pressure welding or plating and a second aluminum copper foil formed of a copper foil 44 deposited on the side of an aluminum foil 42 the same as above. The aluminum faces of the first and the second aluminum copper foil are joined together into an integral structure with a plastic adhesive agent which deteriorates in adhesive strength at a temperature of 170 deg.C or so. By this setup, the aluminum faces bonded together can be easily separated. Moreover, a laminated body of a multilayer printed wiring board can be formed without using a release film, a dummy plate, and a mirror plate. It is enough that only an outer material 21 is interposed between the first layer and the second layer, so that an operation can be simplified. |
