| 摘要 |
PURPOSE:To improve environmental resistance, by a method wherein the whole surface area of the outer circumference of a hollow vessel is sealed by covering the same unitarily with a sealing resin coating layer by incorporating a module assembled body of an electronic circuit into a plastic hollow vessel. CONSTITUTION:A module assembled body of an electronic circuit 1 is incorporated into a closed type plastic hollow vessel 8. The whole surface area of the outer circumference of the plastic hollow vessel 8 is coated with a method of either a transfer molding method or an injection molding method and a sealing resin coating layer 9 is formed under this state. With this construction, packaging is performed while protecting the module assembled body of the electronic circuit 1 and at high productivity. |
