| 摘要 |
PROBLEM TO BE SOLVED: To avoid loss due to mismatching of impedance at joint of a circuit board and a semiconductor chip. SOLUTION: With the part of a circuit board 1 comprising a low-dielectricity body 5 of different dielectric constant, a wiring width W is widened in the region of low-dielectricity body 5, so that the impedance matching at the joint point between a semiconductor chip 6 and the circuit board 1 is easily performed for adjustment of impedance mismatching, resulting in reduced loss due to impedance mismatching.
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