| 摘要 |
A composite solder article comprises: (a) a quantity of a base solder which comprises a non-eutectic alloy; and (b) a temperature control component comprising one or more metals and having a melting point that is higher than the solidus temperature of the non-eutectic alloy, the relative quantities and compositions of the two components being such that when the base solder and the temperature control component have been fused together the resulting solder alloy has a smaller solidus/liquidus temperature difference than the base solder. Preferably the temperature control component is formed from a pure metal that is present in the base solder and especially in such an amount that the overall composition is in the region of the eutectic point. The article may be used for forming solder connections to standard electrical conductors and can exhibit a reduced tendency to flow or ''wick'' along the conductor. |
