SEALING RESIN COMPOSITION AND RESIN-SEALED SEMICONDUCTOR DEVICE

摘要

PURPOSE:To provide a resin composition having excellent thermal impart resistance and moisture-resistant reliability and useful for sealing semiconductor by comprising a thermosetting resin, a melted silica filler, MBS or ABS, a silicone rubber or silicone gel and a mold release agent containing a metal chelate compound. CONSTITUTION:A resin composition for sealing semiconductors comprises (A) a thermosetting resin having a glass transition temperature of >=90 deg.C, preferably a resin composition comprising an epoxy resin, a hardening agent, etc., or a prepolymer prepared by melting and mixing a maleimide resin with an amino compound, etc., (B) 65-90wt.% of a filler prepared from melted silica, preferably one having an uranium content of <=0.05ppb and the maximum particle size of <=75mum, (C) 0.1-10wt.% of MBS or ABS, (D) 0.1-5wt.% of a silicone rubber or silicone gel and (E) 0.01-3wt.% of a mold release agent containing a metal chelate compound, preferably antimony trioxide whose surface is subjected to a hydrophobic treatment.