Electrical connecting apparatus.

摘要

A porous silver plating layer is provided to the surface of pads of a printed circuit board and the surface of contacts provided at the pads of the mother board and these layers are respectively impregnated by tin-zinc alloy and gallium. The electrical connection is established between the pads of printed circuit board and pads of the mother board through existence of liquid alloy by placing these plating layer in contact with each other. For the one printed circuit board having the pads and spacer, the gallium particles are adhered to the pads, while the solder is tentatively adhered to the spacer and for the other printed circuit board having the pads and connecting pads, the tin or indium layer is provided at the surface of pads, then the spacer of former printed circuit board is positioned and fixed to the connecting pad of the other printed circuit board. Thereby, electrical connection can be formed through the contact of gallium-tin or gallium-indium liquid alloy between the pads of both printed circuit boards.