| 摘要 |
A semiconductor manufacturing method employing optical lithography, using a reticle for lithographic alignment. The reticle includes a first area having a desired circuit pattern, and a second area including alignment marks arranged at specific positions, each area being located in an exposure range of an optical exposure apparatus. Each of the alignment marks includes mark elements arranged to form a first geometric shape. Each of the mark elements has main sub-elements arranged in a specific direction at first pitches to form a second geometric shape, and auxiliary sub-elements located at each end of the second geometric shape. Each auxiliary sub-element is apart from one of the main sub-elements at a second pitch. Each main sub-element is optically resolvable, while each auxiliary sub-element is optically irresolvable. Each of the main and auxiliary sub-elements preferably has a linear shape. |
