| 摘要 |
PURPOSE:To obtain a semiconductor module of high reliability, in which a cooling jacket, which is able to allow the follow-up deformation of module component members, is brought into contact with the ceiling panel of the module to prevent stress from concentrating to the component members, by a method wherein an elastic body which presses the cooling jacket against the ceiling panel of the module is pro vided, and a control means which controls the displacement and the force of the elastic body to press is provided to the elastic body. CONSTITUTION:A semiconductor module is provided with a wiring board 1 electrically connected with one or more semiconductor devices 6, a housing composed of a sealing frame 2 formed covering the semiconductor devices 6 provided onto the wiring board 1 and a ceiling panel 3, and a cooling jacket 5 provided in contact with the ceiling panel 3 to cool the semiconductor devices 6, where an elastic body 10 pressing the cooling jacket 5 against the ceiling panel 3 is provided and a control means 11 which controls the displacement and the force of the elastic body 10 to press is provided. For instance, the elastic body 10 is an elastic member 10 which functions so as to moor a printed board 15 and the cooling jacket 5, and the control means 11 which controls the displacement and the force of the elastic member 10 is screws 11 provided to the elastic member 10. |
