发明名称 Photodecomposing organosilicon compounds and photopolymerizable epoxy resin compositions containing the organosilicon compounds
摘要 An organosilicon compound having general formula (I) <IMAGE> (I) wherein R1 represents fluorine; l is an integer of 1 to 5; R2 represents a lower alkyl group, a lower unsaturated alkyl group or an aromatic group, R3, R4, R5 and R6 each represent hydrogen, halogen, an alkyl group, an aryl group, a nitro group, a cyano group, and an alkoxyl group, which may be the same or different; m is an integer of 0 to 2, when m is 2, each R2 may be the same or different; and n is an integer of 1 to 3, provided that m+n is not more than 3 (m+n</=3), and a photopolymerizable epoxy resin composition prepared by mixing an epoxy resin component, the above photodecomposing organosilicon compound, and an aluminum compound are disclosed.
申请公布号 US4954534(A) 申请公布日期 1990.09.04
申请号 US19880219193 申请日期 1988.07.15
申请人 RICOH COMPANY, LTD. 发明人 YAMAMURO, TETSU
分类号 C07F7/18;C08G59/68;G03F7/075 主分类号 C07F7/18
代理机构 代理人
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