| 摘要 |
A new and improved solder tinning paste composition suitable for use as an underlay for metallic solder when solder filling base metal braze joints to facilitate formation of the solder joint between the base metals. The paste composition comprises substantially pure tin powder, suspending agent, inorganic based flux and solvent. Optionally, the paste composition may comprise a deoxidizing agent, a soil removing agent and a surfactant. The solder tinning paste exhibits enhanced flowing and wetting characteristics and a lower melting point. In another aspect thereof, the present invention provides a process for formulating the foregoing solder paste composition.
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