Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor
摘要
Disclosed is a method of chem-mech polishing an electronic component substrate. The method includes the following steps; obtaining a substrate having at least two features thereon or therein which have a different etch rate with respect to a particular etchant; and contacting the substrate with a polishing pad while contacting the substrate with a slurry containing the etchant wherein the slurry includes abrasive particles, a transition metal chelated salt and a solvent for the salt. The chem-mech polishing causes the at least two features to be substantially coplanar. Also disclosed is the chem-mech polishing slurry.
申请公布号
US4954142(A)
申请公布日期
1990.09.04
申请号
US19890285435
申请日期
1989.03.07
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
CARR, JEFFREY W.;DAVID, LAWRENCE D.;GUTHRIE, WILLIAM L.;KAUFMAN, FRANK B.;PATRICK, WILLIAM J.;RODBELL, KENNETH P.;PASCO, ROBERT W.;NENADIC, ANTON