| 摘要 |
<p>PURPOSE:To enable modification without removing a mounting component by providing clearance sections, from which copper foils are punched, to a power supply layer and a ground layer to the peripheral section of the mounting component and passing the wiring pattern of an internal layer through the center of the clearance section only in the case where a trough-hole is shaped under the mounting component. CONSTITUTION:Through-holes 8 for connecting an internal layer on the inside of a flat package 2 are connected by patterns 9, but the patterns 9 are positioned under the package 2. Consequently, patterns 11 are connected to the wiring patterns of the internal layer by the holes 8, and modified regions 12 in which clearances from which copper foils are punched are shaped to a power supply layer and a ground (GND) layer are passed positively. When modification is required, an oblique line section 13 is bored by a drill, the patterns are cut, and modified wirings are executed to the pad of a surface layer. Accordingly, modification is enabled without removing a mounting component.</p> |
