| 摘要 |
PURPOSE:To prevent moisture from creeping into a resin mold by a method wherein a separation part of a support part is formed at a part to which a tape of the support part of a die pad used to mount a semiconductor element has been bonded. CONSTITUTION:A separation part 30 of a support part 22 is formed at a part to which a tape 29 of the support part 22 of a die pad 24 used to mount a semiconductor element 23 has been bonded. After the tape 29 has been bonded, the support part 22 is cut off on the bonded tape by means of a press; the support part 22 is loaded on the semiconductor element 23, and is divided into the side of a die pad to which it is die-bonded and into the side of a guide rail or a section bar; the separation part 30 is formed. Thereby, moisture which has crept from the outside of a resin mold does not reach the die pad through the support part 22. |
