| 摘要 |
The integrated circuit includes at least one circuit configuration (6,8,9,71,72), at least one evaluating element (10), a number of bonding pads and a circuit for selectively connecting the latter to either the circuit configuration or evaluating element. The connecting circuit includes switching circuits (41, 42) between the bonding pads and evaluating element for switching connection between them in response to a control signal. A circuit (Q11,Q12) may be included for controlling the circuit configuration to have a high impedance as seen from the bonding pads in response to the control signal. The control signal may be outputted in response to reception of test signal.
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