| 摘要 |
<p>PURPOSE:To efficiently dissipate heat generated from an element by opening a through hole at a multilayer circuit board between the element and a heat sink fin, and forming a thermal conduction bear filled with thermal conductor in the hole. CONSTITUTION:Circuit forming through holes 4,... and thermal conductive through holes 5,... are opened at each of multilayer circuit boards 1, conductors 6 are filled in the holes 4,... and thermal conductors 7 made of Al, etc., are filled in the holes 5,.... Among them, the holes 5,... and the conductors 7 are all formed at the same position on a green sheet to be accurately coincidentally laminated, wholly pressurized at a predetermined temperature to form a thermal conductive bear 8 passed from one face to the other surface. The bear 8 on one side face of the board 1 and the other face are coated with adhesives 9, 9 having conductivity and thermal conductivity, an element 2 such as a chip component for generating heat is mounted on one side face, and a heat sink fin 3 is mounted on the other side face. Thus, the heat generated from the element 2 can be efficiently externally radiated.</p> |
