| 摘要 |
PURPOSE:To reduce impregnated amount of plating solution and to prevent insulating reliability between through holes from decreasing by curing the resin of a resin layer in the degree of not losing its adhesive. CONSTITUTION:Resin layers 12, 14, 16 between inner layer circuits 13, 15 and/or between the circuits 13, 15 and outer layer circuits 11, 17 are cured in the degree of not losing its adhesive. Thus, it is cured in the degree of not losing its adhesive to eliminate gaps between the circuits 13, 15 and the resin by the adhesive effect of the resin. The resin cured in the degree of not losing its adhesive is completely cured by heat received in case of resist coating, drying, soldering after plating of a multilayer circuit board. Thus, plating solution is scarcely immersed to prevent decreases in connecting reliability due to smear and insulating reliability between through holes. |
