发明名称 CONDUCTIVE MULTILAYER STRUCTURE RESIN PARTICLE AND ANISOTROPIC CONDUCTIVE ADHESIVE USING IT
摘要 PURPOSE: To provide conductive multilayer structure resin particles for an anisotropic conductive adhesive capable of being connected at a low pressure suppressing the generation of cracks on an ITO electrode and realizing high connection stability, especially long term connection stability, and to provide the anisotropic conductive adhesive containing this particles. CONSTITUTION: This conductive multilayer structure resin particle is prepared by making at least one layer of inner layers softer than the outermost layer, chemically bonding at least one layer between adjacent two layers, and covering the surface of the outermost layer with metal, and the anisotropic conductive adhesive contains these resin particles.
申请公布号 KR20020008010(A) 申请公布日期 2002.01.29
申请号 KR20010042234 申请日期 2001.07.13
申请人 MITSUI TAKEDA CHEMICALS, INC. 发明人 FUJII TATSUO;SASAKI ICHIRO;TACHIBANA SHINJI
分类号 C09J9/02;C08L101/12;C09J11/08;C09J201/00;H01B1/22;H01B5/00;H01B5/16;(IPC1-7):C09J9/02 主分类号 C09J9/02
代理机构 代理人
主权项
地址