| 摘要 |
PURPOSE:To improve tensile strength at a normal temperature and a high temperature, decrease the loop height of bonding, and obtain a gold alloy thin wire for bonding use which is suitable for a thin package type device, by adding yttrium, calcium, and beryllium to high purity gold. CONSTITUTION:The following are added to high purity gold whose purity is higher than or equal to 99.99wt.%; 3-100wt.ppm yttrium, 1-50wt.ppm calcium, and 1-10wt.ppm beryllium. The total amount of of these added elements in the title alloy thin wire is in the range of 5-110 wt.ppm. Thereby, high temperature tensile strength is improved, the loop height of bonding can be made low, wire flow of sealing resin is not caused, and a high speed automatic bonder can be sufficiently coped with. Further, the shape of a formed ball shows a true sphere, so that the title alloy wire can be practically used as a bonding wire for a thin package type device, with high reliability. |
