发明名称 CONNECTING METHOD FOR CIRCUIT BOARD
摘要 PURPOSE:To connect a circuit board in which the thickness of assembly is not increased and a terminal and a through hole are not necessarily provided by providing steps of aligning master circuit boards and slave boards in the same plane, coating over adjacent side ends with adhesive to be temporarily adhered, placing conducting chips over adjacent pads to the side ends of the boards and soldering them. CONSTITUTION:In a connecting method for circuit boards, a main circuit board 1 is, for example, placed on a working base, slave circuit boards 2 are then aligned, and adjacent side ends are coated thereover with adhesive 4 to be temporarily adhered. Then, printed wirings are coated with solder paste 5, and conducting chips 7 are placed on adjacent pads 3a, 3b together with mounting components 6 thereover. Thereafter, solder paste reflows to complete an assembling work. Thus, a connecting method for circuit boards without increasing the thickness of an assembly and without necessity of providing a terminal and a through hole.
申请公布号 JPH02216891(A) 申请公布日期 1990.08.29
申请号 JP19890037457 申请日期 1989.02.16
申请人 NEC CORP 发明人 IIJIMA TAMOTSU
分类号 H01R11/01;H05K1/14;H05K3/34;H05K3/36 主分类号 H01R11/01
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