发明名称 TEMPERATURE CONTROL METHOD
摘要 <p>PURPOSE:To enable highly precise temperature control by supplying a large amount of temperature control fluid to a temperature-controlled substance, without bursting of a pipe or leakage of the fluid, by circulating temperature control fluid by means of supplying the temperature control fluid to the temperature-controlled substance so as to drive it and by means of sucking the temperature control fluid from the temperature-controlled substance so as to drive it. CONSTITUTION:For cooling of a placing table 3 in an inspection device for a semiconductor wafer, it is cooled by feeding and circulating coolant 10, which is reservoired in a tank 11, to the placing table 3. This circulation is done by pumps 15 and 16. Thereupon, the pump 16 to suck the coolant 10 for driving is provided. For this reason, even if the coolant 10 is supplied to the placing table 3 by applying pressure by the pump 15, the supplied coolant is sucked by the pump 16, and the liquid pressure lowers. By using the same pumps for these pumps 15 and 16, the liquid pressure inside the placing table 3 and each pipe does not rise to the atmospheric pressure, and bursting of the pipe and liquid leakage from joints 8a and 8b, etc., can be prevented, and the placing table 3 can be cooled accurately and stably.</p>
申请公布号 JPH02216843(A) 申请公布日期 1990.08.29
申请号 JP19890037719 申请日期 1989.02.17
申请人 TOKYO ELECTRON LTD 发明人 SUGIYAMA MASAHIKO;HATTA MASATAKA
分类号 H01L21/66;G01R31/26;H01L21/302;H01L21/67;H01L21/68 主分类号 H01L21/66
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