| 摘要 |
PURPOSE:To simplify steps of forming a wiring pattern and a through hole metallized, etc., and to manufacture a green sheet multilayer circuit board for shortening a manufacturing lead time by forming the wiring pattern of two layer laminates and through hole metallized in one green sheet, then bending them along a bending line, and then laminating then. CONSTITUTION:A green sheet 1 is divided into four sections, and a surface pattern layer 4, an inner pattern layer 5, a rear pattern layer 6 and a dummy pattern layer 7 formed with wiring patterns and through hole metallized, etc., at predetermined positions are formed by printing steps. Then, the sheet 1 is bent at a first bending line 2. Thereafter, the sheet 1 is bent along a second bending line 3. In this case, the layer 4 is disposed thereon, and the layer 6 is disposed thereunder. After the laminating step is finished, it is baked to form a green sheet multilayer circuit board. Thus, multilayer circuit board having patterns 4-6 on the front, inner and rear faces are formed from one sheet. |
