| 摘要 |
PURPOSE:To realize multipin actualization without enlarging the size of a chip by arranging relay chips where a plurality of relay pads are provided at the outside position of a semiconductor chip having a circuit function, and connecting a part of the middle of a bonding wire, which connects an electrode pad with an outer lead, to the relay pad. CONSTITUTION:The relay chip 6 is a semiconductor chip which does not have a circuit function and has only relay pads 7 being electrically insulated from each other and capable of wire bonding. And the island 4 of a lead frame has an area capable of mounting a main chip 1 and relay chips 6 specified distance apart, and the main chip 1, to nearly the center of the island 4, and the relay chips 6, onto the islands 4 on both sides of the main chip 1, are stuck respectively. On the other hand, through the inner electrode pad 2 of the main chip 1 and the outer lead 3 are connected by a bonding wire 5, hereupon a part of the middle of the bonding wire 5 is connected to the relay pad 7 of the relay chip 6. |
