| 摘要 |
PURPOSE:An inexpensive abrasive material containing a specific amount of abrasive grains of fused quartz of high purity having a specific grain size dispersed in an alkaline solution, having high grinding speed for grinding the rear surface of a semiconductor wafer, e.g. silicon single crystals, etc. without damaging the surface excessively. CONSTITUTION:An abrasive material for semiconductor wafers, obtained by wet pulverizing a fused quartz block having >=95% purity in a ball mill lined with alumina for 100hr to give SiO2 fine particles containing >=70wt% fine particles having 0.1-10mum particle diameter, incorporating and dispersing 30wt% above- mentioned SiO2 fine particles in an alkaline solution of 9-12pH such as NH4OH solution, and adding a dispersing agent, preferably aluminum sulfate, thereto. |
