| 摘要 |
<p>Mould suitable for being employed in techniques for high-frequency moulding of plastics. It is made of a material of the pulverulent and/or granular type exhibiting no dielectric loss and consequently permeable to a high- frequency electrical field, the constituent particles of the material being joined together by a binder based on a resin exhibiting good behaviour at high temperature of the order of 200 to 250 DEG C, such as a resin of the polyepoxy or phenol-formaldehyde type. Application: moulding of thermoplastic and heat-curable materials.</p> |
