| 摘要 |
<p>The invention relates to a cooling structure for the kind of a high frequency power transistor, in which the heat of the power loss is conducted from a semiconductor piece through a collector conductor. In contact with of the collector conductor (C) or as its extension there is a metal piece (9), which is essentially larger than the collector conductor, the size of which is about what the electrical coupling of the collector conductor requires, which metal piece is firmly attached to the transistor (8), which metal piece is after the installing solidly attached to an adjustment slip (7) of the transistor placed on acircuit board.</p> |
