| 摘要 |
PROBLEM TO BE SOLVED: To provide a protective package for an electronic device where yield is improved without damaging an electronic device stored therein. SOLUTION: A method for forming the protective package comprises a step of using a mold 10, the mold comprising a half mold 15 that has a lug directing toward the inside of the mold, the lug being capable of elastic deformation and comprising one end having an element 17 that comes into contact with at least a part of an electronic circuit 13 by pressurizing contact, and a step of injecting resin into the mold so that the protective package has a hole part aligned with at least the part of the electronic circuit.
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