| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a method of manufacturing the same with which collector resistance is reduced and reliability is improved. SOLUTION: This semiconductor device includes a first conductive type array layer (4), having an ordered array structure which is formed on a first conductivity-type collector contact layer (3) connected to a collector electrode (13), a first conductivity-type compensated layer (5) formed on the array layer (4), a first conductivity-type collector layer (6) formed on the compensated layer (5), a base layer (7) formed on the collector layer (6) and connected to a base electrode (9), and emitter layers (8, 10 and 11) formed on the base layer (7) and connected to an emitter electrode (12).
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