发明名称 FLEXIBLE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a flexible circuit board and a method of manufacturing the same capable of easily forming a narrow pitch circuit and retaining high bending resistant. SOLUTION: Circuit patterns are formed by etching conductive layers on both side of a base insulation film 1, and at the same time, a conductive land 2 having a hole 4 in its center is formed on one surface where circuits on both side are conductively connected, a conductive land 3 having no hole is formed on the other opposed reverse face, a via hole 6 is formed by removing a spot of the base insulation film 1 exposed in a hole 4 of the conductive land 2 with laser irradiation, and conductive paste 7 is filled in the via hole 6.
申请公布号 JP2002261413(A) 申请公布日期 2002.09.13
申请号 JP20010055636 申请日期 2001.02.28
申请人 FUJIKURA LTD 发明人 KUROKAWA ATSUSHI;OMINATO TADANORI
分类号 H05K1/11;H05K3/06;H05K3/40;(IPC1-7):H05K1/11 主分类号 H05K1/11
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