发明名称 ALIGNMENT METHOD OF SUBSTRATE IN SUBSTRATE TREATING DEVICE AND THE SUBSTRATE TREATING DEVICE
摘要 PROBLEM TO BE SOLVED: To correctly perform alignment without any carrying error even when the position dislocation of a substrate is large. SOLUTION: The alignment method has a step for rotating the substrate by the rotation of a stage and calculating primary correction data from position dislocation, a step for comparing the primary correction data with prescribed maximum correction possibility data, a step for outputting a correction signal in accordance with the primary correction data in the case that the primary correction data is the maximum correction possibility data or less and outputting a correction signal in accordance with secondary correction data being the data of the maximum correction possibility data or less in the case that the primary correction data is large than the maximum correction possibility data, and a step for controlling the position relation of a robot and the stage in accordance with the correction signal so that the robot receives the substrate from the stage at a position correcting the position dislocation. In the case that the receiving of the substrate is output from the secondary correction data, the alignment is repeated once again.
申请公布号 JP2002261154(A) 申请公布日期 2002.09.13
申请号 JP20010058218 申请日期 2001.03.02
申请人 ANELVA CORP 发明人 ISHIMURA TORU;SUZUKI TOMOSATO;NASHIMOTO KIYOSHI
分类号 C23C14/54;C23C16/52;H01L21/285;H01L21/677;H01L21/68;(IPC1-7):H01L21/68 主分类号 C23C14/54
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