| 摘要 |
PURPOSE: A multi-chip package having a logic device and a memory device is provided to solve a thermal problem efficiently by the independence of low paths of a memory device and a logic device. CONSTITUTION: A multi-chip package(10) comprises a circuit pattern(23) having a defined circuit and a junction pad(24) having a width and a depth capable of a wire bonding. At this point, the junction pad(24) is connected with the circuit pattern(23). The multi-chip package(10) further includes a PCB(Printed Circuit Board)(21) formed with a ball pad(25) having a number of solder balls(81) as an outer connection terminal. At this point, the center portion of the PCB(21) is opened so as to mount a chip. At this point, the solder balls(81) are arrayed having a matrix shape on one surface of the PCB(21). |
