发明名称 TARGET FOR SPUTTERING
摘要 PURPOSE:To facilitate the adjustment of electrical characteristics, by containing a proper amount of Si and Al respectively in Ni-Cr alloy having a specific composition to enhance the stability degree of the value of resistivity of a thin film resistor using the obtained title target. CONSTITUTION:A main target for sputtering is obtained by containing 1.5-5.0wt Si and 2.5-8.0wt% Al in a Ni-Cr alloy of which the component ration of Ni and Cr is in a range of 3:2-2:3. In preparing a thin film resistor by using this target, even if presice management of a sputtering condition is not carried out, the thin film resistor having the stable value of resistivity and excellent in reproducibility of electrical characteristics can be obtained.
申请公布号 JPS5822379(A) 申请公布日期 1983.02.09
申请号 JP19810119837 申请日期 1981.07.30
申请人 TAMA DENKI KOGYO KK 发明人 ONO YUZURU;NISHIMURA SEIYA
分类号 C22C19/05;C22C27/06;C23C14/14;C23C14/34 主分类号 C22C19/05
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