| 摘要 |
A multilayer printed circuit board comprises a plurality of insulating layers (a) and a plurality of circuit conductor layers. (a) and (b) are laminated and bonded alternately. (a) is obtd. by impregnating a sheet-like base material with a varnish contg. a solvent and a thermosetting resin compsn. comprising a poly(phydroxystyrene) derivative resin of formula (I) and (c). A=alkyl gp.; X= halogen gp.; R= C2-4 alkylene or alkenoyl gp.; p= 1- 4; q=0 or 1-3; n=1-100, p, q and n are all integers. (c) is a radical polymerisation-inhibitor, and an epoxy modified polybutadiene of formula (II) Y= epoxy resin; m= 4-100. The thermosetting resin compsn. provides prepregs and laminates with a low dielectric constant.
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