| 摘要 |
PURPOSE:To improve the heat dissipation property and transient heat characteristics of the title device and to prevent a wire bonding failure from generating in the device by a method wherein a recessed part is provided in a ceramic substrate and a semiconductor element and an intermediate conductive layer for connection with an external device are respectively provided on the recessed part and the protruding part of the substrate. CONSTITUTION:A semiconductor element 3 is provided on a thin-walled part 1a of a recessed part of a ceramic substrate 1 and heat which is generated from the element 3 is dissipated through the part 1a. Moreover, a heat capacity at a transient time is secured by a thickwalled part 1b of a protruding part of the substrate 1. Moreover, an intermediate conductive layer 2 for connection with an external device is provided on the surface of the part 1b and bonding wires 4 and 5 can be made short. By this constitution, the heat dissipation property and transient heat characteristics of a device are improved and the device becomes a highly reliable semiconductor device, in which a wire bonding failure is hardly generated. |
