发明名称 Electroplating process
摘要 A method for metal plating the surface of a nonconducting article. The method includes a step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal. One of the electrodes is the article to be plated and is provided with a surface having areas of a catalytic metal chalcogenide conversion coating. The metal chalcogenide is of a metal that would be catalytic to electroless metal deposition.
申请公布号 US4952286(A) 申请公布日期 1990.08.28
申请号 US19880153366 申请日期 1988.02.08
申请人 SHIPLEY COMPANY INC. 发明人 BLADON, JOHN J.;ROBINSON, JOHN N.;ROUSSEAU, MICHAEL
分类号 C25D5/54;H05K3/18;H05K3/42 主分类号 C25D5/54
代理机构 代理人
主权项
地址