发明名称 |
Electroplating process |
摘要 |
A method for metal plating the surface of a nonconducting article. The method includes a step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal. One of the electrodes is the article to be plated and is provided with a surface having areas of a catalytic metal chalcogenide conversion coating. The metal chalcogenide is of a metal that would be catalytic to electroless metal deposition.
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申请公布号 |
US4952286(A) |
申请公布日期 |
1990.08.28 |
申请号 |
US19880153366 |
申请日期 |
1988.02.08 |
申请人 |
SHIPLEY COMPANY INC. |
发明人 |
BLADON, JOHN J.;ROBINSON, JOHN N.;ROUSSEAU, MICHAEL |
分类号 |
C25D5/54;H05K3/18;H05K3/42 |
主分类号 |
C25D5/54 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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