| 摘要 |
PURPOSE:To increase the density of mounting by forming clearances or holes to several one part of a plurality of terminals regarding the semiconductor device with the terminals which are drawn out of a molding body wrapping a semiconductor pellet and are bent rectangularly. CONSTITUTION:The holes 3a, 3a... are formed near sections bent rectangularly of a large number of the terminals 3, 3,... drawn out of the side surface of the molding body 1. In such a semiconductor device, one semiconductor device is stacked onto another semiconductor device while the positions of the terminals are conformed and the noses of the terminals 3 of one semiconductor device having the same characteristics as another semiconductor device are inserted into the holes 3a of the terminals of the semiconductor device positioned at a lower section, and the terminals are mutually connected, thus increasing the density of mounting without changing a mounting area on a wiring substrate. |
