发明名称 |
Stackable integrated circuit chip package with improved heat removal |
摘要 |
A pin grid array package for carrying an integrated circuit chip having input/output leads. The pin grid array package includes a carrier having a centrally located opening for carrying the integrated circuit chip, a plurality of input/output pins spaced around the periphery of the centrally located opening, interconnect leads on the carrier for connecting selected ones of the input/output pins to selected leads of the integrated circuit chip, and heat sink material around the periphery of the input/output pins which serves as a cooling-fin for efficient integrated circuit chip heat removal. Each of the plurality of input/output pins is normal to the plane of the integrated circuit chip and extends through the carrier with a first portion extending away from a first side of the carrier and a second portion extending away from a second side of the carrier. The first portion of each input/output pin has a centrally located passage therein, and the second portion has a reduced pin portion for pluggable engagement with a centrally located passage of a similar input/output pin such that the pin grip array package is stackable.
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申请公布号 |
US4953060(A) |
申请公布日期 |
1990.08.28 |
申请号 |
US19890347976 |
申请日期 |
1989.05.05 |
申请人 |
NCR CORPORATION |
发明人 |
LAUFFER, DONALD K.;SANWO, IKUO J.;ROSTEK, PAUL M. |
分类号 |
H01L23/498;H01L25/065;H01L25/10;H05K7/02;H05K7/10 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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