Method of mounting electronic components

摘要

A method of mounting electronic components, comprising steps of: sucking an electronic component by a suction nozzle provided at the tip of a mounting head; holding the sucked electronic component in position by a centering device having an opening and closing mechanism and provided separately from the mounting head, and while holding the component applying adhesive to a side of the electronic component, the side being opposite to that sucked onto the suction nozzle; and mounting the electronic component to a designated position on a printed circuit board. The nozzles on the head are of different sizes.