| 摘要 |
<p>PURPOSE:To improve the degree of freedom in a method through which a plurality of devices are connected mutually, and to miniaturize an electronic apparatus device and mount it easily with high density by forming a stepped section to a mounting surface for electrode terminals and arranging each electrode terminal along the diagonal line of the mounting surface. CONSTITUTION:A mounting surface for electrode terminals of an upper sheath case 1a is formed in stepped structure consisting of an upper mounting surface 8 and a lower mounting surface 9. A collector terminal 2a and an emitter terminal 2b as output electrode terminals are disposed to the mounting surface 8, a base terminal 2c and a base intermediate terminal 2d as input electrode terminals are arranged to the mounting surface 9, and each terminal is disposed approximately on the diagonal lines of the mounting surfaces 8, 9. Accordingly, not only a parallel connection and a rectangular connection but also connections at various angles are enabled only by rectilinear metallc plates such as copper plates 6 in a connection method of parallel connection, and limits to the mounting and arrangement of a semiconductor device and each circuit constitutional part are reduced largely.</p> |
