PACKAGE FOR SEMICONDUCTOR,申请号JP19890034361-传众专利搜索

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发明名称	PACKAGE FOR SEMICONDUCTOR
摘要
申请公布号	JPH02213155(A)	申请公布日期	1990.08.24
申请号	JP19890034361	申请日期	1989.02.14
申请人	MITSUBISHI ELECTRIC CORP	发明人	USUKI TOSHIO
分类号	H01L23/08	主分类号	H01L23/08
代理机构		代理人
主权项
地址

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