发明名称 DICING SAW
摘要 PURPOSE:To cut the body of a long life and hard one of a sapphire and so on by forming diamond film by CVD at the tip blade part. CONSTITUTION:A CVD diamond film 2 is formed by a CVD method on the surface of a plate like base material 1 consisting of a plastic or nickel, stainless steel or tungsten, carbide and so on, and the desired dicing saw is obtained. This tip blade is not necessarily formed in a discoid shape, a CVD diamond film 2 may be formed only on one main face of the base material 1, also the tip blade part may be laminated in multiple-layer.
申请公布号 JPH02212065(A) 申请公布日期 1990.08.23
申请号 JP19890030470 申请日期 1989.02.09
申请人 SEIKO EPSON CORP 发明人 IWAMATSU SEIICHI
分类号 B24B27/06;B28D5/00 主分类号 B24B27/06
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