| 摘要 |
Small amounts of lead can be used in cobalt electroless plating compositions in order to refine the structure of the deposited cobalt. The lead also stabilises the composition, particularly when additive particles are present and the composition is adapted to deposit a composite cobalt deposit. The additive particles in the composite may have been pre-treated with lead, cadmium, tin, zinc, mercury, thallium, bismuth and/or antimony, and/or lead may be added to the plating composition. Cadmium may also be present. Lactic acid has been found to have a beneficial moderating effect on the plating operation. |
